What this product is used for
Amorphous core material with PCB-mounted winding structure, ultra-thin design. Designed for high power density power modules (server power, communication power) for SiC/GaN high-frequency applications.
Core Features
Core Features
• Amorphous core, extremely low high-frequency loss
• PCB surface mount, space-saving
• Ultra-thin design, height only 8-15mm
• Suitable for SiC/GaN power device high-frequency applications
• Small leakage inductance, excellent EMI suppression
Typical Parameters
Engineering Support
ProMagTech supports custom inductance, current rating, core material, insulation class, cooling method, and mounting structure based on your converter topology and application environment.
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